國立臺灣大學

I. Purpose of the Program: In line with Winbond Semiconductor's ESG policy and continuous promotion of sustainable development goals, this program aims to subsidize student club activities to encourage the younger generation to personally experience the values of Social Responsibility (S) and Environmental Protection (E).

II. Eligibility: Student clubs from national, public, and private colleges and universities.

III. Grant Amount: NT$10,000 per proposal, with a maximum of 21 proposals for this academic year.

IV. Program Themes: Focused on "Social Responsibility" and "Environmental Protection," design relevant service activity proposals.

V. Application Process: Please download the "Proposal Template" and other related documents (total of 5 pages) from the official Winbond Semiconductor website, fill them out, upload the electronic files to your personal cloud storage, and fill in the relevant information on the registration page. Registration page URL: https://www.surveycake.com/s/WxKxe

VI. Application Schedule:

• Registration: From now until April 12th, 112 (Friday)
• Announcement of Results: April 26th, 112 (Friday)
• Application for Funds: Before May 17th, 112 (Friday)
• Disbursement of Funds: Expected before May 31st, 112 (Friday)
• Activity Execution: From the announcement of results until September 30th, 112 (Monday)
• Activity Closure: Provide a "Completion Report" (total of 4 pages) within one month after the activity ends.

VII. Evaluation Method:

• Selection by the organizer based on completeness, effectiveness, and innovation of the proposals.
• Each college or university prioritizes one subsidized club. Special cases will be discussed separately.
• Incomplete or non-compliant application materials will not be accepted.

VIII. Other Notes:

• Winbond Semiconductor is the supervisory unit and will provide the company's logo for display in relevant outputs.
• The electronic files (photos, videos, text content, etc.) provided by subsidized clubs must be licensed to Winbond Semiconductor for sharing without charge. Personal data protection regulations will be strictly observed.
• During the implementation of proposed activities, please arrange relevant insurance and prioritize safety.
• Subsidy eligibility will be canceled for violations of laws and regulations.

IX. In the event of force majeure preventing the execution of proposals, please formally notify and arrange for a refund.

X. Winbond Semiconductor reserves the right to modify, change, suspend, or terminate this program at any time.

XI. Contact: Mr. Chen Zhaoyu and Ms. Lin Yating, Human Resources Department, Winbond Semiconductor, Tel: (03) 397-5999 #18894, #18893, Email: winhrrs1@winfoundry.com, anderc@winfoundry.com, yatingl@winfoundry.com